Microscopic defects such as invisible cracks, edge chipping, silicon drop, and corner chipping are major causes of reduced cell efficiency, lower module reliability, and even customer complaints. Precisely and stably detecting these defects on high-speed production lines is critical for PV manufacturers to improve yield and reduce costs.

Vision Potential introduces the Invisible Crack Inspection Module SC-MC-W, a high-precision automated inspection device specifically designed for production line invisible crack detection. The module integrates TFC, TFC+visible light, TFC+backlight invisible crack, bright-field backlight, and dark-field backlight solutions. Combined with NIR infrared imaging and AI algorithms, it achieves full-process coverage from silicon slicing to cell manufacturing for PV invisible crack detection.

Invisible Crack Inspection Module SC-MC-W

I. Flexible Multi-Solution Switching for All Process Stages

Different process stages and cell technology routes require different inspection solutions. SC-MC-W supports one-click switching between bright-field/dark-field invisible crack solutions and TFC series solutions without additional calibration, quickly adapting to PERC, TOPCon, HJT, xBC, and other mainstream or next-generation cell technologies.

• Silicon slicing manufacturing: Accurately detects invisible cracks, broken wafers, silicon drop, edge chipping to ensure incoming material quality.

• Cell manufacturing – in-process inspection: Covers texturing, diffusion, coating, etching, metallization, etc. Dark-field solutions avoid poor imaging and high interference of traditional methods.

• Incoming material inspection: Quality check for purchased wafers and semi-finished cells to prevent defective materials from entering production.

• University/laboratory research: Supports custom parameters, providing high-precision imaging data for defect mechanism research and algorithm validation.

II. High Speed & High Precision, Matches Production Rhythm

• Throughput ≥6,000 pcs/h, inspection time 0.25–0.5s per piece, meeting high-volume continuous production.

• Imaging resolution ≥0.1 mm/pixel, minimum detectable crack width >50μm, with 900–1700nm dedicated crystalline silicon wavelength to capture tiny defects.

• Size compatibility: Supports 156×156mm to 210×210mm (half/full cell), thickness 160–200μm, no adapter change required.

• Multiple resolution options: 1k/4k pixel NIR-enhanced InGaAs camera or 4K line-scan CMOS, exposure time adjustable from 10μs to 10s.

III. AI Algorithm + Defect Traceability for Quality Closure

The built-in self-developed AI inspection software automatically records defect location, type, and size, generating traceable inspection reports. This helps process engineers identify root causes and optimize upstream processes. Imaging data can be exported and is compatible with third-party analysis software, meeting both production statistics and academic research needs.

IV. Robust and Reliable Hardware & Software

• Light source: Semiconductor laser (wavelengths 1100±5nm / 1300±5nm / 1450±5nm), spot uniformity ≥90%.

• Manual focus distance 400–650mm, high-definition wide-angle lens (16/25/45mm optional, FOV ≥80°).

• Industrial PC with Windows + standard AI software, supports manual adjustment of exposure time, defect size/length/gray level, etc.

• Dimensions: 350×250×600mm, weight ~20kg, single-phase AC220V power supply, operating temperature 15–50°C.

V. Typical Defects and Imaging Examples

The module clearly images invisible cracks, edge chipping, notches, corner chipping, fragments, scratches, silicon drop, perforation, and more. Multiple imaging modes (bright-field, dark-field, TFC) provide intuitive comparison for users.

Conclusion: Vision Potential Invisible Crack Inspection Module SC-MC-W, with its flexible multi-solution switching, high-speed high-precision performance, and AI-powered traceability, delivers a true one-stop solution for production line invisible crack detection. For technical details or demo testing, please contact Vision Potential.